midas NFX
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General Electronic Products
Electronic products are complex to design and have different types of requirements on the shape, the size, the resistance, the heat dissipation and heat deformation.

Midas NFX provides a full range of simulation tools to analyze electronic equipments and optimize the design of such equipments. Midas NFX provides static and nonlinear structural analysis, as well as steady state and transient thermal transfer and thermal stress analysis, along with fluid dynamics/heat coupled solutions to investigate the flow of heat as well as natural convection around electronic equipments.
Solutions of general electronic products
Relevant Analysis
Heat Transfer/ Thermal Stress Analysis
NFX 2012 offers practical heat transfer and heat stress analysis capabilities. Especially heat stress analysis is provided as an independent analysis case. As such, a single analysis can produce temperature results by heat transfer and thermal deformation/thermal stress results.
  • Steady and transient heat transfer analyses
  • Nonlinear heat transfer analysis function considering temperature-dependent materials and conditions
  • Various load conditions
    - Heat generation, conduction, convection, radiation, heat flux, initial temperature, fixed temperature conditions
  • Thermal contact function to simulate heat conduction between discontinuous parts
  • Heat transfer analysis function considering cavity radiation
    - Open/closed conditions
    - Radiation shape factor calculation
  • Effective transient heat transfer analysis using sensor
    - Automatic termination of analysis based on standards
    - Minimum/maximum/average temperatures in a selected domain defined under the sensor conditions
Nonlinear Static Analysis
Explicit Dynamic Analysis
 


News & Events
2017-09-25
Enhancements in NFX 2018R1
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2016-09-01
Enhancements in midas NFX 2017R1
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2015-12-22
[Event In Italy] Introduzione alla Simulazione Strutturale nella Progettazione Meccanica
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